Pliobond Adhesive 1oz

PLIOBOND 20 adhesive is a general-purpose thermosetting adhesive that can be used to bond virtually all porous and non-porous substrates. When cured, PLIOBOND 20 adhesive provides tough, chip resistant bonds that remain flexible over a wide temperature range. Substrates bonded with PLIOBOND 20 adhesive offer excellent resistance to mechanical shock and oxidization. This adhesive provides outstanding dielectric properties and has low water absorption. PLIOBOND 20 adhesive comes ready to use, no conditioner, accelerator or catalyst is required.